15gm jar of heatsink compound / thermal grease (HCCONS0007)

Soldering accessories, project boxes, keypads, battery holders etc.
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15gm jar of heatsink compound / thermal grease (HCCONS0007)

Post by admin » Fri Oct 11, 2013 2:52 pm

Image

Features:
Good thermal conductivity performance
Joints the CPU and heat sink together better
Reduces the gap between the heat sink and the CPU so that the CPU's heat can be passed to the heat sink faster
Enhances the cooling effect of heat sink

Specification:
Model: HC-131
Colour: White
Heat Conduction Number: > 0.65
Thermal Resistance: <0.262
Operating Temperature: -30 to 150 ℃
Ingredients: Silicon compound 50%, carbon compound 20%, oxidizing metal compound 30%

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